Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

Heat pipe is the use of evaporative refrigeration effect, because of the temperature difference between the two ends, so that the heat conduction quickly. The heat pipe is divided into two parts: the evaporating heating end and the condensing end. When the heated end starts to be heated, the liquid around the tube wall will vaporize instantaneously and generate steam. At this time, the pressure of this part will increase and the steam flow will flow to the condensing end under the traction of the pressure. When the vapor flow reaches the condensing end, it condenses into a liquid, at the same time, it also gives off a lot of heat, and finally returns to the heated end of evaporation with the help of capillary force and gravity to complete a cycle.

Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

Heat pipe is a new heat transfer element with high thermal conductivity. It transfers heat through the evaporation and condensation of the liquid in the fully closed vacuum tube. It uses the fluid principle such as siphoning to play a good cooling effect. It has the characteristics of high thermal conductivity, good isotherm, heat transfer area on both sides of cold and hot can be changed arbitrarily, heat transfer can be conducted from a distance, and the temperature can be controlled.

At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

Vapor Chamber is usually used for electronic products requiring small size or rapid dispersion of high heat. At present, it is mainly used in 5G mobile phones, servers, high-end graphics cards and other products. It is a strong competitor of the heat pipe cooling method.