Focused on Thermal Innovation, Empowering the Digital Future
—Your One-Stop Thermal Solution Expert, Safeguarding Data Centers and AI Computing Power
In today’s era of explosive growth in computing demand, thermal management has become a critical factor affecting the stability, efficiency, and longevity of high-performance computing equipment. With years of deep expertise in thermal solutions, our company has built an end-to-end service chain covering thermal and structural design, simulation, rapid prototyping, precision testing, and mass production. We are dedicated to providing efficient, reliable, and customized air cooling and liquid cooling solutions for data centers (including CPUs, memory, and switches) and AI computing equipment (such as GPU computing cards).
1. Data Center Cooling Solutions: Stable, Efficient, Scalable
As the core infrastructure of the digital economy, data center cooling systems must maintain stability under continuous high loads while balancing energy efficiency and operational costs. We offer layered cooling support for different devices and scenarios:
CPU Cooling: For high-core-count, high-TDP server processors, we have developed a series of air and liquid cooling modules. Air cooling solutions utilize high-density fins, optimized heat pipe layouts, and intelligent speed-control fans to achieve efficient heat dissipation in limited spaces. Liquid cooling solutions offer a full stack of options from cold plates to immersion cooling, particularly suitable for high-density racks and supercomputing scenarios, helping to continuously lower PUE values.
Memory and Switch Cooling: As data rates increase, power consumption and heat generation from memory modules and switch chips are becoming more significant. We optimize airflow through structural design, provide customized auxiliary heat sinks for memory modules, and develop efficient airflow-guiding enclosures and chip-level cooling solutions for switches, ensuring stable operation of all components even in high-temperature environments.
Competitive Advantage: We not only provide standard cooling products but also excel in customized designs based on rack layout, airflow organization, and local climate conditions. Through thermal simulation, we validate solution feasibility early, avoiding costly late-stage modifications, and help customers achieve holistic thermal optimization from chip to room level.
2. AI Computing Power Cooling Solutions: Tackling High Power and High Density
AI training and inference are driving power consumption of accelerators like GPUs to new heights, with single-card power exceeding kilowatt levels, pushing traditional air cooling to its limits. We offer next-generation cooling support for GPU computing cards and AI servers:
Enhanced Air Cooling: For small to medium-scale AI clusters, we design high-performance air cooling modules featuring large copper bases, multiple heat pipes in parallel, and high-static-pressure fans, supporting sustained GPU overclocking while balancing cost and efficiency.
Liquid Cooling Systems: For high-density AI computing racks, we provide complete cold plate and immersion liquid cooling solutions. Cold plates make direct contact with GPU cores for rapid heat extraction, while immersion cooling submerges entire servers in dielectric coolant for ultimate heat dissipation and silent operation, significantly increasing computing density and energy efficiency.
Highlight: We possess full in-house development capabilities for liquid cooling systems, covering cold plate design, piping layout, coolant selection, and monitoring systems. We hold multiple patents in sealing and leak prevention, flow balance, and corrosion protection, ensuring long-term stability and safety of liquid cooling systems.
3. End-to-End Service Advantage: From Design to Mass Production
We are not just a cooling product supplier but a technical partner to our customers. Our core strengths include:
Integrated Delivery Capability: From thermal simulation and structural design to prototyping, performance testing, and mass production, all processes are handled in-house, shortening development cycles and ensuring solution consistency.
Simulation-Driven Design: We use CFD simulations to accurately predict thermal performance before prototyping, optimizing airflow and coolant channel designs to reduce trial-and-error costs and improve success rates.
Testing and Validation Closure: Our fully equipped environmental and endurance testing labs simulate various operating conditions, ensuring cooling solutions meet real-world deployment requirements.
Scalable Manufacturing and Quality Control: With automated production lines and strict quality control from material intake to shipment, we support rapid scaling and delivery to meet global supply chain demands.
Closing
In the face of escalating thermal challenges in the computing era, we are driven by technological innovation and supported by full-chain services, continuously delivering high-performance, highly reliable air and liquid cooling solutions. Whether for data center energy efficiency upgrades or AI computing infrastructure build-outs, we are committed to being your most trusted thermal management partner, pushing the boundaries of computing efficiency and empowering an intelligent future.
Dedicated to Thermal Management — Cooling Every Bit of Computing Power.
For specific case studies or technical details, please feel free to contact us.
