Our company specializes in advanced thermal management solutions tailored for high-performance AI computing environments. We have developed a comprehensive product portfolio that addresses the critical cooling demands of modern data centers, particularly for AI GPU acceleration cards.
Our key strengths in the AI computing space include:
High-Density Cooling Expertise: We offer both air-cooled and cold plate liquid cooling solutions designed for high-density GPU deployments, such as 8-card OAM (OCP Accelerator Module) clusters and multiple PCIe-based compute cards.
Dual-Mode Thermal Solutions: We provide flexible cooling architectures—from efficient air-cooled heatsinks for PCIe and OAM GPUs to advanced liquid cold plates and modular liquid cooling systems capable of supporting configurations with 8 or 12 cold plates. This ensures optimal thermal performance whether in traditional or fully liquid-cooled racks.
Support for Leading AI Hardware: Our solutions are compatible with popular AI accelerators, including NVIDIA’s GeForce RTX 4090 and other data center-grade PCIe GPUs, enabling reliable and sustained performance during intensive AI training and inference workloads.
Scalable System Design: Our liquid cooling systems are engineered for scalability, allowing seamless integration into existing data center infrastructures while significantly improving thermal efficiency and energy utilization.
Reliability and Performance Optimization: By effectively managing heat dissipation in compact, high-power environments, our cooling solutions help extend hardware lifespan, reduce throttling, and maintain peak computational throughput—key factors for AI and HPC applications.
Through continuous innovation in thermal engineering, we empower data centers and AI infrastructure providers to achieve higher computational density, improved energy efficiency, and greater overall system stability in the era of accelerated computing.
