




With the development of information technology, cloud computing and big data are gradually entering people's lives. As a node of the network, the server stores and processes 80% of the data and information on the network. It is similar to a general computer chassis, including processors, hard disks, memory, and system buses.

The needs of multiple media flow, cloud storage, data mining, analysis, and machine learning applications have been promoted to the demand for high -performance computing solutions, thereby increasing the number of CPUs and GPUs of the server to increase the speed of the processor. Due to the limited server volume, many high -power electronic components run in their long -term and high -load operations, and whether the heat generated by electronic components can be transmitted to the external stability of the server operation in a timely manner.
Servers heat dissipation usually requires several combinations of heat dissipation methods. In addition to active heat dissipation such as air -cooled and water cooling, in the heat dissipation solution, advanced thermal management materials, such as heat -conducting silicon film, heat conduction gel, etc. Help the connected, efficient heat dissipation path.

3C products are also called information appliances, which generally refers to computers, consumer communication and consumer electronics products. Various types of market demand is large. China has become the world's largest 3C product consumer market. The improvement of income levels also put forward higher requirements for the quality of electronic products. Merchants have launched higher configuration, higher performance, and better design products to meet consumers.

There are many factors that affect the quality of electronic products. Among them, heat dissipation is a factor that cannot be ignored. Especially after the "Samsung Battery Door" event was fermented in 2016, electronic manufacturers pay more attention to the heat dissipation performance and safety of the product. How can we ensure that the heat dissipation of electronic products meets rigorous design requirements?Planning thermal management issues at the beginning of the product design cycle is the best way to achieve the most efficient cooling solution. Hongfuhan Technology is a domestic first-class cooling technology service provider, which can provide cooling solutions for IT communication electronic products, involving: board (motherboard) cooling, CPU cooling, graphics card cooling, RF module cooling, RU cooling, game console cooling , VR cooling, industrial computer (machine) cooling, server cooling, central inverter air conditioning cooling, TEC cooling and other fields.


The goal of design simulation to design simulation:
| PCB source temperature | ≤100℃ |
| CPU temperature | ≤80℃ |
With the continuous development of modern communication technology, the power density of electronic and communication equipment is getting higher and higher, so the temperature caused by the equipment has risen sharply. The work life and performance of the equipment are closely related to Wen Yan. The heat management of electronics and communication equipment is facing huge challenges. How to solve the heat dissipation problem in a limited equipment space, how to control the component temperature within the allowable range, and how to ensure that the noise of the fan does not exceed the limit? Is choosing wind cooling or water cooling?

As the "heart" of the communication system, the 5G communication power supply determines the reliability of the entire system. In order to reduce and maintain cost benefits, improving the heat dissipation and reliability of the communication power supply is one of the main requirements of 5G communication power supply. For communication data, most of the existing equipment expansion methods are used to build 5G communication devices, which is often limited to the power space required for 5G communication power cabinets, and it can only be used in the original power cabinet. In these cases, the power supply can be used. In these cases The output power of the cabinet needs to increase significantly, which requires the communication power module, also known as the rectification module to increase the output power significantly when the volume is basically unchanged, that is, the power density increases.

However, due to the increased power density of power, the heat dissipation and insulation of power electrons became a bottleneck. Generally, the power device of the communication power supply is seriously heated, so it is necessary to heat dissipation through aluminum shells. Thermal conductivity tablets and heat -conducting gel can be well applied to the communication power supply to help solve the heat dissipation problem.

In 5G communication, the number of micro -base stations will increase significantly. Most of these small base stations will be installed in a closed space. Therefore, this type of communication power supply is intelligent. Appropriate heat dissipation solution
The inverter is also called power regulator. The process of converting DC electric energy into AC electric energy is called inverter, the circuit that completes the inverter function is called inverter circuit, and the device that realizes the inverter process is called inverter equipment or inverter. In solar power generation system, inverter efficiency is an important factor to determine the capacity of solar cells and batteries. Failure of photovoltaic inverter will lead to shutdown of photovoltaic system and direct loss of power generation, so high reliability is an important technical indicator of photovoltaic inverter.

Good heat dissipation of PV inverter is an important condition to ensure its high reliability operation. Therefore, heat dissipation simulation test at the beginning of inverter design has become the first consideration of PV inverter manufacturers.
In our normal use of medical equipment, due to the role of current, the internal temperature of medical equipment will be increased to different degrees. If the temperature exceeds the safe range under normal circumstances, a radiator or cooling device should be installed to ensure the normal operation of the equipment in use, which protects the service life of the equipment itself and improves the safety of the equipment. We can often see in the movie that when the electronic equipment and instruments are used beyond the load, the instrument will burn or even explode, so the radiator's role in the electronic equipment and instruments is beyond doubt. Therefore, when the medical equipment is maintained and repaired, the situation of the heat dissipation equipment should also be checked, so as to avoid the overheating of the circuit components caused by the abnormal work of the heat dissipation equipment.

With the continuous development of electronic assembly technology, the volume of electronic equipment is becoming smaller and smaller, the system is becoming more and more complicated, and the high thermal density has become an irresistible trend of development. In order to adapt to the development trend of The Times, the radiator is also constantly innovating, adapting to the pace of The Times novel heat dissipation methods also emerge in endlessly.

From imaging devices to surgical instruments, the powerful medical devices of the 21st century are impressive, thanks in large part to the increased computing power of microprocessors. For cooling engineers, however, these advances have come at a price. Equipment power is more and more large, the shape of the equipment is smaller and smaller, which also makes our radiator in the case of more and more power, in a smaller and smaller space to work, this is also the problem we will face.














