The heat pipe has the advantage of extremely fast heat transfer speed. It can effectively reduce the thermal resistance value and increase the heat dissipation efficiency when installed in the radiator. It has extremely high thermal conductivity, up to hundreds of times the thermal conductivity of pure copper. It is reputed as a "thermal superconductor".

The water-cooled (liquid-cooled) cooling system uses a pump to circulate and dissipate the cooling liquid in the heat pipe. The heat absorption part on the radiator (called the heat absorption box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation. The heat absorbed by the endothermic part is discharged to the outside through a radiator designed on the back of the pyrogen.

Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

Heat pipe is the use of evaporative refrigeration effect, because of the temperature difference between the two ends, so that the heat conduction quickly. The heat pipe is divided into two parts: the evaporating heating end and the condensing end. When the heated end starts to be heated, the liquid around the tube wall will vaporize instantaneously and generate steam. At this time, the pressure of this part will increase and the steam flow will flow to the condensing end under the traction of the pressure. When the vapor flow reaches the condensing end, it condenses into a liquid, at the same time, it also gives off a lot of heat, and finally returns to the heated end of evaporation with the help of capillary force and gravity to complete a cycle.

Relieving the radiator of skived fin spacing can be designed smaller, fin can be thinner, so much for heat dissipation of high power devices, but due to the characteristics of the molding process, each a radiator need from zero processing, that is to say we all can be in the early stage of the design for each project for relieving the radiator parts, including the thickness of the base board, fin height and thickness, Tooth spacing and other data were optimized.

Skived fin heat sinks is a heat dissipation device for the thermal electronic components in electrical appliances, mostly made of aluminum alloy, brass or bronze plate, flake, flake, etc. If it is a side-blown radiator, it should be determined according to the internal air duct structure of the chassis. If you do not know these things about the air duct, then let him blow the heat sink, because the general chassis in the CPU radiator at the same height of the backplane position will have heat dissipation hole, blow shovel teeth heat dissipation fin will be eliminated from the heat dissipation hole of the backplane, more efficient.