At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

Vapor Chamber is usually used for electronic products requiring small size or rapid dispersion of high heat. At present, it is mainly used in 5G mobile phones, servers, high-end graphics cards and other products. It is a strong competitor of the heat pipe cooling method.

Profile radiator has the characteristics of good heat dissipation performance, good energy saving effect and so on. It is one of the widely used radiator types in the market at present.

In the fields of power electronic control, conversion, drive, signal transmission and new energy (new energy vehicle power battery heat dissipation, UPS and energy storage system heat dissipation, large server heat dissipation, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation, etc.), in order to pursue high efficiency, low noise and low temperature operation, and limited by space, The problem of heat dissipation has become the biggest limit of the ideal product development, and the liquid cooling heat dissipation technology has become the preferred thermal management method.

IGBT is the core component of new energy vehicle drive motor, which plays a leading role in the efficiency, power density and reliability of vehicle electric drive, and is called the "heart of the car". The temperature characteristic is an important index of IGBT module product design and reliability evaluation. In order to greatly improve its power density, heat dissipation performance and long-term reliability, efficient heat dissipation scheme is particularly important.

Ultrathin mobile phone Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.