VR/AR/XR/MR Heat pipe thermal module mainly used in VR/AR/XR/MR and other consumer electronics.

As the core working frequency of the graphics card and the working frequency of the video memory continue to rise, the heat of the graphics card chip also increases rapidly. The number of transistors in the display chip has reached, or even exceeded the number in the CPU, so high integration is bound to bring the increase of heat, in order to solve these problems, the graphics card will use the necessary heat dissipation. Especially for overclocking enthusiasts and users who need to work long hours, excellent cooling method is a must for selecting a video card.

Communication equipment VC thermal module is also called Vapor Chamber，the technology is similar to heat pipe in principle, but the conduction mode is different. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.