At present, most data servers, storage servers and cloud servers adopt forced air cooling and heat dissipation structure, and use fan and heat pipe fin welding technology to conduct heat conduction and cooling of server CPU chips. The air-cooled heat dissipation method uses the heat sink to transfer the heat emitted by the CPU to the heat sink, and then blows the heat away by the fan. Therefore, air conditioning is also needed to cool the environment.

The PV skiving fin embedded tube radiator can be designed to be smaller and the fins can be thinner, so it is mostly used for heat dissipation of high-power devices. However, due to the characteristics of its forming process, each radiator needs to be processed from zero, which means that we can optimize the data of each part of the skiving fin radiator, including the thickness of the substrate, the height and thickness of the fins, and the tooth spacing, at the early stage of each project design.

Stamping parts rely on press and die to impose external force on plate, strip, pipe and profile to produce plastic deformation or separation, so as to obtain the required shape and size of the workpiece (stamping parts) forming processing method. Stamping and forging are both plastic processing (or pressure processing), collectively known as forging. The blanks for stamping are mainly hot and cold rolled steel plates and strips.

Pressing is a forming processing method that relies on press and die to exert external force on plate, strip, pipe and profile to produce plastic deformation or separation, so as to obtain the required shape and size of the workpiece (stamping parts). Stamping and forging are both plastic processing (or pressure processing), collectively known as forging. The blanks for stamping are mainly hot and cold rolled steel plates and strips.

The projector works continuously in a narrow space for a long time, and the bulb will emit huge heat. At the same time, the built-in projector voltage stabilized power supply will also emit a lot of heat. If it is not distributed in time, the projector will generate high temperature inside, which will not only reduce the working efficiency of the projector, but also shorten its service life.

The power consumption and heating of notebook computers are increasing with the enhancement of CPU and GPU performance. In order to maintain the stable operation of the system, based on the limited heat dissipation space and the realistic demand for rapid heat dissipation, the heat dissipation scheme of the laptop is generally presented in the form of combination, heat dissipation module is the most important heat dissipation mode of contemporary electronic products.