With the development of LED in the direction of miniaturization and high power, this trend leads to the generation of more heat in a limited volume. If the heat dissipation is not timely, excessive heat accumulation will lead to the rise of the working temperature of high-power LED, affecting the normal operation of high-power LED, and even make high-power LED failure in serious cases. The luminous efficiency of high-power LED is between 15%-25%, of which 75%-85% is converted into heat, LED junction temperature rises, its luminous efficiency decreases, the service life is shortened. It can be seen that temperature is one of the most important factors affecting the reliability of high-power LED, so it is necessary to take technical measures to limit the temperature rise of high-power LED.

The power consumption and heating of notebook computers are increasing with the enhancement of CPU and GPU performance. In order to maintain the stable operation of the system, based on the limited heat dissipation space and the realistic demand for rapid heat dissipation, the heat dissipation scheme of the laptop is generally presented in the form of combination, heat dissipation module is the most important heat dissipation mode of contemporary electronic products.

Profile radiator has the characteristics of good heat dissipation performance, good energy saving effect and so on. It is one of the widely used radiator types in the market at present.

The profile type radiator is one of the radiator types widely used in the market at present because of its good heat dissipation performance and energy-saving effect.

The water-cooled (liquid cooled) cooling system uses the pump to circulate the coolant in the cooling pipe and dissipate heat. The heat absorbing part on the radiator (called the heat absorbing box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, heat dissipation of large photovoltaic inverter, and SVG/SVC heat dissipation. The heat absorbed by the heat absorbing part is discharged to the outside through a radiator designed on the back of the pyrogen.

Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.