Company Profile: Thermal Management Leader for Data Center Switches & Optical Modules
We are a specialized thermal solutions provider focused on the critical cooling demands of high-performance data center infrastructure. With deep expertise in both air-cooling and cold plate liquid cooling technologies, we partner with leading equipment manufacturers to develop advanced, reliable thermal management systems for next-generation switches and optical modules.
Our Core Strengths in Switch & Optical Module Cooling:
Comprehensive Platform Support & Proven Mass Production: We possess an unparalleled track record in delivering mass-production thermal solutions for industry-standard switch ASICs. Our portfolio includes validated designs for Broadcom's flagship Tomahawk series (TH3, TH4, TH5) and the latest TH6, as well as Marvell's Teralynx 10 (TL10). This demonstrates our deep understanding of the thermal profiles and mechanical requirements of these core networking chips, ensuring maximum stability and performance.
Advanced Integrated Solutions for Co-Packaged Optics & High-Density Designs: We excel at solving complex thermal challenges arising from increased integration and density. A key innovation is our combined cooling solution for optical modules co-located with high-power switch ASICs like Broadcom TH6. This integrated approach manages the collective heat load from both the switch chip and adjacent high-speed optics, which is essential for maintaining signal integrity and preventing thermal throttling in next-generation switch architectures.
Cutting-Edge Cooling Technologies for Optical Modules: We offer a range of specialized solutions tailored to the sensitive nature of optical components:
Vapor Chamber (VC) Solutions for Optics: Utilizing high-performance vapor chambers, we provide efficient, uniform cooling for high-power DSP-based optical modules (e.g., 800G, 1.6T), enabling them to operate within strict temperature ranges for optimal performance and longevity.
Floating Cold Plate Technology: Our innovative floating or self-aligning cold plate designs ensure perfect, pressure-optimized contact with the uneven surfaces of optical module housings or switch ASIC lids. This eliminates hot spots, improves thermal interface efficiency, and protects delicate components from mechanical stress.
Collaborative, End-to-End Development Expertise: We operate as a true thermal partner, working closely with clients from the early design phase. Our strength lies in co-developing customized solutions—from initial thermal simulation and design for manufacturability (DFM) to prototyping and full-scale production—ensuring a perfect fit for specific mechanical, acoustic, and thermal constraints.
By combining platform-specific knowledge, innovative cooling architectures, and a partnership-driven model, we empower our clients to push the boundaries of data center network speed and density, all while ensuring system reliability, energy efficiency, and a reduced total cost of ownership (TCO).
