Meizhou Hongfuhan Technology Co., Ltd.

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solution providers and service providers
Integrated thermal conductivity and heat dissipation

HongFuHan

Dedicate To Be
A Thermal Management Leader

Hongfuhan Thermal

Professional · Dedicated · Concentration
We focus on improving quality and cutting the cost

PRODUCT

Air cooling

Liquid cooling

Heat pipe

Vapor Chamber

Extruded heat sink

Skived fin heat sink

Metal parts

Air cooling

The thermal resistance value of air cooled heat pipe radiator can be smaller, which is commonly used in power electronics, IGBT, inverter, transformer, high-power power supply, LED lamps, servers, computers, medical and aesthetic products, etc.

VR/AR/XR/MR Heat pipe thermal module

VR/AR/XR/MR Heat pipe thermal module mainly used in VR/AR/XR/MR and other consumer electronics.

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Game radiator module

Game machine heat pipe welding radiator air cooling module is mainly used for portable devices, game consoles, entertainment products and other consumer electronic products cooling.

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High-performance Computer graphics radiator module

As the core working frequency of the graphics card and the working frequency of the video memory continue to rise, the heat of the graphics card chip also increases rapidly. The number of transistors in the display chip has reached, or even exceeded the number in the CPU, so high integration is bound to bring the increase of heat, in order to solve these problems, the graphics card will use the necessary heat dissipation. Especially for overclocking enthusiasts and users who need to work long hours, excellent cooling method is a must for selecting a video card.

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Photography lamp radiator,LED heat pipe air cooling module

LED film and television lamps have become the choice of lighting in the studio, widely used in the studio, video conference room, recording and broadcasting classrooms and other places. For high-power LED film and television lamps, the heat dissipation problem is getting more and more attention. The light decay and life of LED are directly related to its junction temperature. If the heat dissipation is not good, the junction temperature is high and the life is short. So LED film and television lamps want to improve its performance must solve the problem of heat dissipation.

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Liquid cooling

In the field of power electronic control, conversion, drive, signal transmission and other fields as well as in the field of new energy (new energy vehicle power battery cooling, UPS and energy storage system cooling, large server cooling, large photovoltaic inverter cooling, SVG/SVC cooling, etc, Liquid cooling technology has become the preferred thermal management method.

Controller buried pipe liquid cooling radiator

The water-cooled (liquid cooled) cooling system uses the pump to circulate the coolant in the cooling pipe and dissipate heat. The heat absorbing part on the radiator (called the heat absorbing box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, heat dissipation of large photovoltaic inverter, and SVG/SVC heat dissipation. The heat absorbed by the heat absorbing part is discharged to the outside through a radiator designed on the back of the pyrogen.

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Energy storage copper tube aluminum plate liquid cooling cooling plate

The water-cooled (liquid-cooled) cooling system uses a pump to circulate and dissipate the cooling liquid in the heat pipe. The heat absorption part on the radiator (called the heat absorption box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation. The heat absorbed by the endothermic part is discharged to the outside through a radiator designed on the back of the pyrogen.

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Friction stir welding technology Liquid cooled plate

In the fields of power electronic control, conversion, drive, signal transmission and new energy (new energy vehicle power battery heat dissipation, UPS and energy storage system heat dissipation, large server heat dissipation, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation, etc.), in order to pursue high efficiency, low noise and low temperature operation, and limited by space, The problem of heat dissipation has become the biggest limit of the ideal product development, and the liquid cooling heat dissipation technology has become the preferred thermal management method.

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Vehicle IGBT friction welding water cold plate

IGBT is the core component of new energy vehicle drive motor, which plays a leading role in the efficiency, power density and reliability of vehicle electric drive, and is called the "heart of the car". The temperature characteristic is an important index of IGBT module product design and reliability evaluation. In order to greatly improve its power density, heat dissipation performance and long-term reliability, efficient heat dissipation scheme is particularly important.

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Heat pipe

Heat pipe is a new type of heat transfer element with extremely high thermal conductivity. It transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube. It uses fluid principle such as siphon effect to achieve good refrigeration effect. It has the characteristics of extremely high heat conductivity, good isothermal property, free change of heat transfer area on both sides of cold and hot, long-distance heat transfer, temperature control, etc.

Laptop flattening thin heat pipe

The heat pipe has the advantage of extremely fast heat transfer speed. It can effectively reduce the thermal resistance value and increase the heat dissipation efficiency when installed in the radiator. It has extremely high thermal conductivity, up to hundreds of times the thermal conductivity of pure copper. It is reputed as a "thermal superconductor".

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Ultra-thin copper heat pipe

Heat pipe is the use of evaporative refrigeration effect, because of the temperature difference between the two ends, so that the heat conduction quickly. The heat pipe is divided into two parts: the evaporating heating end and the condensing end. When the heated end starts to be heated, the liquid around the tube wall will vaporize instantaneously and generate steam. At this time, the pressure of this part will increase and the steam flow will flow to the condensing end under the traction of the pressure. When the vapor flow reaches the condensing end, it condenses into a liquid, at the same time, it also gives off a lot of heat, and finally returns to the heated end of evaporation with the help of capillary force and gravity to complete a cycle.

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Conventional heat-conducting copper heat pipe

Heat pipe is a new heat transfer element with high thermal conductivity. It transfers heat through the evaporation and condensation of the liquid in the fully closed vacuum tube. It uses the fluid principle such as siphoning to play a good cooling effect. It has the characteristics of high thermal conductivity, good isotherm, heat transfer area on both sides of cold and hot can be changed arbitrarily, heat transfer can be conducted from a distance, and the temperature can be controlled.

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Flatten sintered heat pipe

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Vapor Chamber

Vapor chamber is usually used for electronic products requiring small volume or rapid heat dissipation. At present, it is mainly used in 5G mobile phones, servers, high-end graphics cards and other products, and is a strong competitor of the heat dissipation method of thermal conduits.

Ultra thin VC Vapor Chamber for mobile phone and notebook

Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

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Ultra-thin mobile phone and tablet Vapor Chamber radiatior

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Conventional Vapor chamber radiator

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Ultrathin Vapor Chamber -Mobile phone VC radiatior

Ultrathin mobile phone Vapor Chamber Vacuum chamber soaking plate is similar to heat pipe in principle, but different in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum cavity soaking plate is conducted on a two-dimensional surface, so the efficiency is higher.

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Extruded heat sink

The profile type radiator is one of the radiator types widely used in the market at present because of its good heat dissipation performance and energy-saving effect.

Internet of Things smart devices aluminum extrusion heat sink

Profile radiator has the characteristics of good heat dissipation performance, good energy saving effect and so on. It is one of the widely used radiator types in the market at present.

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Industrial computer solar flower aluminum extruded radiator

The profile type radiator is one of the radiator types widely used in the market at present because of its good heat dissipation performance and energy-saving effect.

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Photovoltaic inverter radiator Aluminum profile heat sink

Profile radiator has the characteristics of good heat dissipation performance, good energy saving effect and so on. It is one of the widely used radiator types in the market at present.

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Photovoltaic Aluminum extruded heat sink for profile

Aluminum extruded heat sink has the characteristics of good heat dissipation performance, good energy saving effect and so on. It is one of the widely used heat sink types in the market at present.

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Aluminium extrusion heat dissipation1-25

Skived fin heat sink

SKIVING , also known as skiving technology, simply means cutting a single piece of aluminum or copper as needed through a special spatula to cut fins with standard spacing and a certain thickness and height.

PV radiator high-power inverter skiving fin embedded pipe radiator

The PV skiving fin embedded tube radiator can be designed to be smaller and the fins can be thinner, so it is mostly used for heat dissipation of high-power devices. However, due to the characteristics of its forming process, each radiator needs to be processed from zero, which means that we can optimize the data of each part of the skiving fin radiator, including the thickness of the substrate, the height and thickness of the fins, and the tooth spacing, at the early stage of each project design.

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High - density spatula skived fin heat sinks

Relieving the radiator of skived fin spacing can be designed smaller, fin can be thinner, so much for heat dissipation of high power devices, but due to the characteristics of the molding process, each a radiator need from zero processing, that is to say we all can be in the early stage of the design for each project for relieving the radiator parts, including the thickness of the base board, fin height and thickness, Tooth spacing and other data were optimized.

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High density aluminum bucket tooth radiator1-4

Copper heat sink for skived fin heat sinks

Skived fin heat sinks is a heat dissipation device for the thermal electronic components in electrical appliances, mostly made of aluminum alloy, brass or bronze plate, flake, flake, etc. If it is a side-blown radiator, it should be determined according to the internal air duct structure of the chassis. If you do not know these things about the air duct, then let him blow the heat sink, because the general chassis in the CPU radiator at the same height of the backplane position will have heat dissipation hole, blow shovel teeth heat dissipation fin will be eliminated from the heat dissipation hole of the backplane, more efficient.

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All copper skived fin heat sinks

Skived fin heat sinks is a heat dissipation device for the thermal electronic components in electrical appliances, mostly made of aluminum alloy, brass or bronze plate, flake, flake, etc.

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Metal parts

Hardware processing includes: copper aluminum alloy stamping, die casting,CNC machining and other operations

Aluminum alloy stamped FIN

Stamping parts rely on press and die to impose external force on plate, strip, pipe and profile to produce plastic deformation or separation, so as to obtain the required shape and size of the workpiece (stamping parts) forming processing method. Stamping and forging are both plastic processing (or pressure processing), collectively known as forging. The blanks for stamping are mainly hot and cold rolled steel plates and strips.

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Aluminum alloy stamping of equipment shell

Pressing is a forming processing method that relies on press and die to exert external force on plate, strip, pipe and profile to produce plastic deformation or separation, so as to obtain the required shape and size of the workpiece (stamping parts). Stamping and forging are both plastic processing (or pressure processing), collectively known as forging. The blanks for stamping are mainly hot and cold rolled steel plates and strips.

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Die pressed casting

Die casting is a kind of pressure cast parts. It uses the pressure casting machine with the casting mold installed to pour the heated liquid copper, zinc, aluminum or aluminum alloy into the feeding port of the die casting machine. After the die casting machine, copper, zinc, aluminum or aluminum alloy parts with the shape and size limited by the mold are cast.

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Copper stamped FIN sheet

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INDUSTRY

Consumer Electronics

3C products, also known as information appliances, generally refer to computer, consumer communication and consumer electronic products.

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ICT communication

With the continuous development of modern communication technology, the power density of electronic and communication equipment is getting higher and higher, resulting in a sharp rise in equipment temperature.

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Servers solution

Service heat dissipation usually requires the combination of several heat dissipation methods. In addition to active heat dissipation such as air cooling and water cooling, advanced thermal management materials such as thermal conductive silica gel and thermal conductive gel are also used as auxiliary heat transfer media in the heat dissipation scheme to help realize connected and efficient heat dissipation path.

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Photovoltaic inverter

Inverter, also known as the power regulator, the process of converting DC into AC power is called the inverter, the circuit to complete the inverter function is called the inverter circuit, the device to realize the inverter process is called the inverter equipment or inverter.

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Energy storage system

The stable operation of energy storage system is related to the safety and stability of power grid, so the major energy storage system manufacturers attach importance to its quality, and among the factors affecting the stability of energy storage system, the heat dissipation performance is undoubtedly the most important.

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Medical equipment

In our normal use of medical equipment, due to the role of current, the internal temperature of medical equipment will be increased to different degrees.

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Laser equipment

Laser, as a strong artificial light source, is widely used. At present, high-end projectors have a lot of use of laser as a light source, whether direct or reflective, the output brightness, color saturation, gamut and so on are higher than the current ordinary light source.

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Electric vehicle

New energy, as an important embodiment of green energy. Automobile, as an important carrier of new energy promotion.

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IPC solution

Industrial control, that is, industrial automation control, mainly refers to the use of computer technology, microelectronics technology, electrical means, to make the production and manufacturing of the factory more automatic, efficient, precise, and with control and visibility.

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SVC solution

Applications in the field of renewable energy -- photovoltaic inverter /SVG/ wind power converter. Photovoltaic inverter/wind power converter /SVG and other equipment based on high-power power electronic devices often work in harsh environment, and have extremely high working requirements for equipment heat dissipation.

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ABOUT US

Meizhou Hongfuhan Technology Co., Ltd. is mainly engaged in the R&D and production of various heat transfer and heat dissipation functional devices, and is committed to providing customers with one-stop comprehensive thermal management solutions. Meizhou Hongfuhan is a holding subsidiary of Hongfuhan [Stock code: 301086], and its business direction is one of the most important strategic development directions of Hongfuhan Group.

The types of Hongfuhan heat dissipation products include conventional heat pipe/VC temperature equalizing plate, ultra-thin heat pipe/VC temperature equalizing plate, heat pipe module, VC module, liquid cooling radiator, profile radiator, shovel tooth ra......

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