Data center liquid cooling modules are high-efficiency thermal solutions for high-power chips like CPUs and AI GPUs. A cold plate makes direct contact with the chip, and internal microchannels guide coolant to rapidly absorb and remove heat, far exceeding air cooling capacity. This module ensures precise temperature control, eliminates hot spots, and guarantees stability during overclocking and sustained full-load operation. 

The inner-manifold distributes coolant from a single inlet to multiple parallel branches through integrated flow channels. It precisely delivers coolant to each CPU/GPU cold plate, ensuring balanced flow distribution and thermal equilibrium. This design serves as an optimized solution for implementing liquid cooling in high-density servers.

The thermal resistance value of air cooled heat pipe radiator can be smaller, which is commonly used in power electronics, IGBT, inverter, transformer, high-power power supply, LED lamps, servers, computers, medical and aesthetic products, etc.

Heat pipe transfers heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube. It uses fluid principle such as siphon effect to achieve good refrigeration effect. It has the characteristics of extremely high heat conductivity, good isothermal property, free change of heat transfer area on both sides of cold and hot, long-distance heat transfer, temperature control, etc.

Vapor chamber is usually used for electronic products requiring small volume or rapid heat dissipation. At present, it is mainly used in 5G mobile phones, servers, high-end graphics cards and other products, and is a strong competitor of the heat dissipation method of thermal conduits.

The 3D Vapor Chamber features an internal 3D wick and support pillars, enabling efficient evaporation-condensation cycles on all internal surfaces. This shifts heat transfer from 2D planar to 3D spatial spreading, offering superior thermal performance, exceptional temperature uniformity, and the ability to manage very high heat fluxes. It is a pivotal solution for cooling next-generation high-power processors.