3DVC offers superior thermal management with extremely high and uniform thermal conductivity, efficiently spreading heat from concentrated hotspots. Its thin, lightweight design enables slimmer device profiles while providing structural support. It excels in cooling high-power, compact electronics like smartphones, 5G modules, and gaming devices, ensuring stable performance and temperature control under heavy loads.
Customized
Provide one-stop service
Radiator / Heat sink / Ultrathin heat pipe / Vapor Chamber / Liquid cooling plate
Requirement Communication
ONE
Determine solution
TWO
Concluding a contract
THREE
Down payment
FOUR
Proofing and validation
FIVE
Mass production processing
SIX
QC & QA
SEVEN
Logistics distribution
EIGHT
Customer satisfaction acceptance
NINE
Customer service
TEN
