

The water-cooled (liquid-cooled) cooling system uses a pump to circulate and dissipate the cooling liquid in the heat pipe. The heat absorption part on the radiator (called the heat absorption box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation. The heat absorbed by the endothermic part is discharged to the outside through a radiator designed on the back of the pyrogen.
The water-cooled (liquid-cooled) cooling system uses a pump to circulate and dissipate the cooling liquid in the heat pipe. The heat absorption part on the radiator (called the heat absorption box in the liquid cooling system) is used to absorb heat from the new energy battery power pack, 5G communication equipment, IGBT controller, UPS and energy storage system, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation. The heat absorbed by the endothermic part is discharged to the outside through a radiator designed on the back of the pyrogen.
In the fields of power electronic control, conversion, drive, signal transmission and new energy (new energy vehicle power battery heat dissipation, UPS and energy storage system heat dissipation, large server heat dissipation, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation, etc.), in order to pursue high efficiency, low noise and low temperature operation, and limited by space, The problem of heat dissipation has become the biggest limit of the ideal product development, and the liquid cooling heat dissipation technology has become the preferred thermal management method.
Buried pipe process selection:
Shallow buried pipe process: It is suitable for single-side installation of devices. After copper pipe is flattened, the surface is milled with aluminum plate at the same time, which is fully conducive to the high thermal conductivity of copper pipe to take away heat, and the lightweight of aluminum to reduce weight and cost control.
Deep buried pipe process: Suitable for the packing of high thermal conductivity epoxy resin imported from the United States, double-sided device temperature difference requirements are not high, can be single-sided double-sided installation devices, because the thickness of the copper pipe has not been secondary processing, and packing protection can provide the safety of the application, especially suitable for the use of cold plate as the medium.
Double-sided pipe clamping process: the two sides of the installation device, simple process and low cost; Aluminum plate + aluminum tube & copper tube & stainless steel tube.
Customized
Provide one-stop service
Radiator / Heat sink / Ultrathin heat pipe / Vapor Chamber / Liquid cooling plate

Requirement Communication
ONE

Determine solution
TWO

Concluding a contract
THREE

Down payment
FOUR

Proofing and validation
FIVE

Mass production processing
SIX

QC & QA
SEVEN

Logistics distribution
EIGHT

Customer satisfaction acceptance
NINE

Customer service
TEN



